Thermal Grizzly Carbonaut 31 x 25 x 0.2 mm thermal pad

Thermal Grizzly Carbonaut 31 x 25 x 0.2 mm is a thermal pad for people who want a predictable and easy-to-install contact between cooling and component, without the hassle of paste. The format 31 x 25 x 0.2 mm is convenient for small contact areas – laptops, VRM, memory, small heatsinks. The thermal conductivity of 62.5 W/mk is seriously high for a thermal pad and is aimed at stable heat exchange under higher loads. This is a product from Thermal Grizzly with a clear focus on efficiency and reusability.

What you get: a thermal pad with a specific size 31 x 25 x 0.2 mm, which you can place directly, without measuring, spreading, and cleaning paste every time. The thickness 0.2 mm helps fill small irregularities between the chip and the radiator, without losing contact pressure. With thermal conductivity of 62.5 W/mk, you can rely on the heat not to “hang” in the pad, but to reach the cooling quickly enough. The limit temperature of -250 °C to +150 °C gives you peace of mind in both cold environments and high temperatures under load, as long as you stay within specifications. Quantity/Weight 4g means that you get one pad of fixed size, which you can move as needed between different configurations.

• A thermal pad with a size 31 x 25 x 0.2 mm, suitable for small contact areas like chips, VRM, or memory.
• Thickness 0.2 mm, balancing between good compression and filling fine irregularities between surfaces.
• Very high thermal conductivity of 62.5 W/mk, to transfer heat effectively to the cooling.
• Limit temperature -250 °C / +150 °C, making it stable at both low and high operating temperatures.
• Quantity/Weight: 4g, provided as a ready-to-use pad without the need for dosing and spreading.
• Product code TG-CA-31-25-02-R, if you want to search for it by service or production number.
• Manufacturer Thermal Grizzly, focused on solutions for effective heat exchange.

It is suitable if you want a clean, repeatable installation – for example, during frequent laptop servicing, test benches, or small components, where you don’t want to deal with thermal paste every time. It is also a good choice in situations where you need consistent thickness and contact, and cannot rely on perfectly flat surfaces. It is not suitable if you are looking for arbitrary sizes or greater thickness – here the size and 0.2 mm are fixed.

The most sensible aspect here is the combination of precise size, thin profile, and thermal conductivity 62.5 W/mk, which makes this thermal pad a practical option for serious cooling configurations, without unnecessary hassle.