Thermal pad Thermal Grizzly Minus Pad 8 30 x 30 x 1.5 mm

Thermal Grizzly Minus Pad 8 30 x 30 x 1.5 mm is a thermal pad for situations where you want stable and predictable heat exchange without the mess and hassle of paste. The format 30 x 30 mm and thickness 1.5 mm make it convenient for VRMs, laptop chips, memory, and other components where there is a larger gap between the cooler and the surface. The thermal conductivity of 8 W/mk is serious for a thermal pad and is a good level for gaming and enthusiast configurations. With a temperature range of -100° C to +250° C, you can rely on it to withstand even more extreme loads.

What you get

You get 1 piece of thermal pad with exact dimensions of 30 x 30 mm and thickness of 1.5 mm, which is convenient if you want to replace old, hardened pads on a graphics card, motherboard, or laptop. The thickness of 1.5 mm helps to compensate for larger distances between the cooler and the element, without having to stack several thinner pads. The thermal conductivity of 8 W/mk provides better heat dissipation than standard OEM pads, which can lead to lower temperatures under load and less thermal throttling. Thanks to the wide temperature range, you won't have to worry about either cold environments or prolonged operation at high temperatures.

• Thermal pad from Thermal Grizzly, aimed at more serious configurations and cooling upgrades.
• Type thermal pad with a ready shape and thickness, which makes installation easier compared to liquid paste.
• Dimensions 30 x 30 mm, suitable for covering larger chips or groups of elements.
• Thickness 1.5 mm, convenient when there is a larger gap between the heatsink and components.
• Thermal conductivity 8 W/mk, which allows for more effective heat dissipation from standard pads.
• Temperature range of -100° C to +250° C, ensuring stable operation in a wide range of scenarios.
• Delivered as 1 piece with product code TG-MP8-30-30-15-1R, so you can easily identify it for future orders.

Who it is suitable for

This thermal pad is suitable if you are repairing or upgrading graphics cards, motherboards, laptops, or other devices where you need more serious heat exchange and a thicker pad. It is suitable for gaming and high-load systems where temperatures are critical. It is not an optimal choice if you are looking for ultra-fine tuning with very thin pads or precise sizes for a specific layout without cutting.

The most sensible aspect here is the combination of thickness 1.5 mm, thermal conductivity 8 W/mk, and wide temperature range – you get a reliable thermal pad that can actually lower temperatures compared to old or cheap pads.