Thermal Pad OEM Thermal Pad TC550 - 15 x 15 x 0.5mm

This thermal pad OEM Thermal Pad TC550 - 15 x 15 x 0.5mm is a compact blue thermal pad for precise applications – from cooling VRM and memory chips to small controllers and modules. It positions itself as a practical and technically balanced solution, with good thermal conductivity and softness that helps fill gaps between the chip and the heatsink. The size 15 x 15 mm and thickness 0.5 mm make it convenient for places with limited space where you don't want to risk too large a gap. The operating temperature range of -40° ~ 150° covers typical PC, consumer, and industrial scenarios without drama.

What you get

With thermal conductivity of 5.5 W/mK, this thermal pad is a noticeable upgrade over cheap low-end pads and helps the heat from the chip reach the heatsink more effectively. The thickness of 0.5 mm is good if your cooler sits almost flush, but there are still small gaps that thermal paste alone cannot compensate for. Thanks to the hardness Shore C 25, the material is soft enough to conform to surfaces, but not so soft that it tears easily during installation. The density 2.7 g/cm3 suggests a solid material with decent thermal transfer, without being too heavy or crumbly. Add the wide temperature range and you get a stable thermal pad for long-term operation in various environments.

• Thermal conductivity 5.5 W/mK, which ensures good heat transfer from chips to heatsink or metal casing.
• Operating temperature range -40° ~ 150°, suitable for PC, consumer electronics, and heavier conditions.
• Compact dimensions 15 x 15 mm, convenient for VRAM, VRM, small controllers, and other small components.
• Thickness 0.5 mm, ideal when the distance between the component and the heatsink is small, but not perfectly zero.
• Hardness Shore C 25, providing a balance between softness for good adhesion and sufficient strength during installation.
• Density 2.7 g/cm3, indicating a stable material with a good compromise between durability and thermal properties.
• Blue color for easy visual differentiation from other pads and easier installation in tight chassis.

Who it is suitable for

This thermal pad is suitable if you want to replace or improve the cooling of memory chips, VRM modules, or other small elements in a PC, laptop, or other device. It works well for users who know the distance they have between components and the heatsink and need a thin pad. If you need a thick pad for large gaps or extreme overclocking with the highest quality material, you better look for another type of thermal pad.

The most sensible aspect here is the combination of reasonable thermal conductivity 5.5 W/mK, thin profile 0.5 mm, and stable temperature limits, making it a practical choice for many everyday and enthusiast repairs and modifications.