Thermal pad Thermal Grizzly Minus Pad 8 30 x 30 x 2.0 mm

Thermal Grizzly Minus Pad 8 30 x 30 x 2.0 mm is a thermal pad for those who want better contact between the cooler and chips where thermal paste is not practical – VRM, memory chips on the GPU, chips around the CPU socket, consoles, and more. This is a mid/high-end solution focused on stable heat transfer and easy installation. With its thermal conductivity of 8 W/mk and thickness of 2.0 mm, this pad is suitable when you have larger gaps to fill between cooling and components. It operates in a wide temperature range from -100° C to +250° C, making it suitable for more serious modifications and heavy-duty systems.

What you get

You get a thermal pad with a size of 30 x 30 mm, which is enough to cover a larger chip or several smaller components if you cut it to size. The thickness of 2.0 mm helps you compensate for unevenness or larger distances between cooling and the elements on the board without smearing and dealing with precise application of paste. The thermal conductivity of 8 W/mk is a solid balance between flexibility and good heat exchange – suitable for VRM, memory, chips in consoles or mini PCs. The temperature range from -100° C to +250° C means that the pad remains stable both at low and at quite high temperatures under load, without leaking or hardening unexpectedly.

• Thermal pad from Thermal Grizzly, aimed at enthusiasts and those who want reliable thermal contact without unnecessary compromises.
• Thermal conductivity 8 W/mk, providing effective heat transfer from chips to the cooler in heavy-duty systems.
• Size 30 x 30 mm, convenient for covering VRM areas, memory modules, or larger controllers, with the option to cut to size.
• Thickness 2.0 mm, suitable for situations with larger gaps between components and the radiator, where thin pads do not reach.
• Temperature range from -100° C to +250° C, providing peace of mind during long loads and higher operating temperatures.
• Single pack – 1 pc., which is practical if you need exactly one pad for a specific repair or upgrade.
• Product code TG-MP8-30-30-20-1R, easy for reference if you want to order the same size and thickness again.

Who it is suitable for

It is suitable if you are replacing or adding thermal pads on GPU, VRM sections, memory chips, or other components where standard pads are worn out or of poor quality. It is also a good option for more precise mods on cooling, where you know you need exactly 2.0 mm thickness. If you are looking for ultra-thin pads for minimal gaps or a kit with many sizes in one package, this specific model may not be the most convenient choice.

The combination of 8 W/mk thermal conductivity, 2.0 mm thickness, and stable temperature range makes this thermal pad a practical tool when you want to improve cooling without unnecessary gymnastics.