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Kolink Umbra Pro TP-1 Thermal Paste - 1.5g Kolink Umbra Pro TP-1 Thermal Paste - 1.5g Kolink Umbra Pro TP-1 Thermal Paste - 1.5g
Kolink Umbra Pro TP-1 Thermal Paste - 1.5g Kolink Umbra Pro TP-1 Thermal Paste - 1.5g Kolink Umbra Pro TP-1 Thermal Paste - 1.5g

Kolink Umbra Pro TP-1 Thermal Paste - 1.5g

5.00 €
Earn 5 points
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Kolink
Manufacturer
Kolink
Kind
Thermal paste
Quantity/Weight
1.5g
Thermal conductivity
12.8 W/mk
View all specifications

Description

Kolink Umbra Pro TP-1 is a thermal paste aimed at people who want stable temperatures without unnecessary marketing gimmicks. You get a compact package of 1.5g, fully sufficient for several applications on CPU or GPU, depending on the size of the chip. With thermal conductivity of 12.8 W/mk, the paste is at a decent 'performance' level for gaming and more serious loads. It is suitable for both a new build and a refresh of an old system that has already raised temperatures.

What you get

The main feature of Umbra Pro TP-1 is the balance between high thermal conductivity 12.8 W/mk and a consistency that allows for easy application. The viscosity of 3 g/cm³ means that the paste is not too liquid and does not spill, but it is also not concrete that is hard to spread – this helps to fill the microscopic irregularities between the CPU/GPU cap and the cooling base well. The amount of 1.5g is enough for several mounting/dismounting cycles or for one CPU + one or two GPU attempts if you want to experiment with different application methods. The zero warranty here is not a problem – the thermal paste is a consumable, and what really matters are the specifications and proper application.

  • Thermal paste Kolink Umbra Pro TP-1 of type thermal paste, suitable for CPU and GPU applications.
  • Thermal conductivity 12.8 W/mk, which helps for better heat transfer from the chip to the cooling during gaming and prolonged load.
  • Quantity 1.5g, enough for several applications or for several tests with different coolers.
  • Viscosity 3 g/cm³, providing good density – does not flow easily and effectively fills micron irregularities.
  • Manufacturer Kolink, known in PC enthusiast circles with a focus on components for custom builds.
  • Categorized as thermal paste, intended for contact between chip and cooling, not for thermal pads or other applications.
  • Warranty 0 months, typical for consumables of this type, where proper use is key, not service support.

Who it is suitable for

It is suitable if you are building a gaming or work PC and want something more meaningful than the cheapest pastes, but without chasing extreme overclocking. It is also a good option for servicing and refreshing old machines, laptops, or GPUs, where the old paste has already dried out. If you are in a scenario with extreme temperatures and aggressive overclocking, you may want to compare it with more specialized solutions, but for mass gaming and daily use, this is a completely adequate choice.

The most sensible thing here is the combination of 12.8 W/mk thermal conductivity, well-chosen viscosity, and 1.5g quantity, which covers several projects without paying for excess volume that will just sit in a drawer.

Full specifications

Manufacturer
Kolink
Kind
Thermal paste
Quantity/Weight
1.5g
Thermal conductivity
12.8 W/mk
Others
Viscosity: 3 g/cm³
Type
Thermal paste
Warranty
0 months

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