Thermal Pad OEM Thermal Pad TC550 - 15 x 15 x 1.5mm

The OEM Thermal Pad TC550 - 15 x 15 x 1.5mm is a compact thermal pad for cooling chips, VRM, memory, and other components where there is a gap between surfaces. It is positioned in the reliable mid-range class, with good thermal conductivity and convenient sizes for small elements. Thanks to a thermal conductivity of 5.5 W/mK and a thickness of 1.5 mm, it is suitable for bridging the temperature between component and heatsink where thermal paste is not practical. The blue color also helps visually see where it is placed and whether it covers the contact area well.

What you get: a soft, compressible thermal pad that compensates for unevenness and distances between chip and heatsink, without flowing like thermal paste. The density of 2.7 g/cm³ and hardness of Shore C 25 mean balanced elasticity – soft enough to fill micro-spaces, but stable enough not to tear easily during installation. The temperature range of -40° to 150° covers typical PC and electronic applications – from cold start to heavy load. The size 15 x 15 mm is convenient for single chips; if the component is larger, you can easily combine several pads.

• Thermal conductivity of 5.5 W/mK, allowing effective heat transfer between the chip and heatsink in mass PC and electronic configurations.
• Operating temperature range of -40° ~ 150°, suitable for long-term operation at standard and higher operating temperatures.
• Size of the thermal pad 15 x 15 mm, practical for RAM chips, VRM modules, small controllers, and other compact components.
• Thickness of 1.5 mm, which helps fill larger gaps between component and heatsink, where thin pads do not reach.
• Density of 2.7 g/cm³ for a stable structure that does not deform excessively and maintains good contact over time.
• Hardness of Shore C 25, providing softness for good adhesion while also sufficient strength during installation and removal.
• Blue color that facilitates visual inspection during positioning and when checking the contact area.

Who it is suitable for: if you are refreshing the thermal pads on GPU, VRM, memory, or other hardware and need a universal pad with reasonable thickness, this model does a good job. It is especially convenient for smaller chips and areas with larger gaps. It is not the optimal choice if you need an extremely thin pad or very high thermal conductivity for hardcore overclocking.

The combination of 5.5 W/mK, 1.5 mm thickness, and moderate hardness makes this thermal pad a flexible choice for many scenarios – from supporting ready systems to fine-tuning custom cooling.